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A2F060M3E-1TQG144I

Microsemi Corporation
RoHS
/
Package 144-LQFP
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC FPGA 60K GATES 128KB 144-TQFP
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Technical Details

Physical

Package / Case 144-LQFP
Supplier Device Package 144-TQFP (20x20)

Compliance

RoHS Status RoHS Compliant

Technical

Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion?
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Frequency 100MHz
Base Part Number A2F060M3E
Interface EBI/EMI, I2C, SPI, UART, USART
Number of I/O MCU - 21, FPGA - 33
Speed 100MHz
RAM Size 16KB
Core Processor ARM? Cortex?-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size 128KB

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