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A2F060M3E-1FG256

Microsemi Corporation
RoHS
/
Package 256-LBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-M3 100MHZ 256FBGA
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Technical Details

Physical

Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)

Technical

Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series SmartFusion?
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 100MHz
Base Part Number A2F060M3E
Operating Supply Voltage 1.5V
Interface EBI/EMI, I2C, SPI, UART, USART
Number of I/O MCU - 26, FPGA - 66
Speed 100MHz
RAM Size 16KB
Core Processor ARM? Cortex?-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Max Frequency 100MHz
Number of Logic Blocks (LABs) 8
Speed Grade 1
Primary Attributes ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
Number of Registers 1536
Flash Size 128KB

Compliance

Radiation Hardening No
RoHS Status Non-RoHS Compliant

Alternative Model

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