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XA7Z030-1FBG484Q

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 484-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 667MHZ 484FCBGA
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Technical Details

Physical

Package / Case 484-BBGA, FCBGA
Surface Mount YES

Technical

Operating Temperature -40°C~125°C TJ
Packaging Tray
Published 2010
Series Automotive, AEC-Q100, Zynq?-7000 XA
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 484
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Other uPs/uCs/Peripheral ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
Power Supplies 11.8V
Number of I/O 130
Speed 667MHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Kintex?-7 FPGA, 125K Logic Cells
UV Erasable N

Dimensions

Height Seated (Max) 2.54mm
Length 23mm
Width 23mm

Compliance

RoHS Status RoHS Compliant

Alternative Model

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