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M2S050T-FG896I

Microsemi Corporation
RoHS
/
Package 896-BGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-M3 166MHZ 896FBGA
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Technical Details

Physical

Package / Case 896-BGA
Surface Mount YES

Dimensions

Height Seated (Max) 2.44mm
Length 31mm
Width 31mm

Technical

Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion?2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 896
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B896
Number of Outputs 377
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 377
Speed 166MHz
RAM Size 64KB
Core Processor ARM? Cortex?-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 377
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 50K Logic Modules
Number of Logic Cells 56340
Flash Size 256KB

Compliance

RoHS Status Non-RoHS Compliant

Alternative Model

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