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M2S050TS-1FG896

Microsemi Corporation
RoHS
/
Package 896-BGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-M3 166MHZ 896FBGA
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Technical Details

Supply Chain

Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)

Physical

Package / Case 896-BGA
Supplier Device Package 896-FBGA (31x31)

Technical

Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion?2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 377
Speed 166MHz
RAM Size 64KB
Core Processor ARM? Cortex?-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Primary Attributes FPGA - 50K Logic Modules
Flash Size 256KB

Compliance

RoHS Status Non-RoHS Compliant

Alternative Model

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