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XCZU2CG-1SFVA625I

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 625-BFBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description FPGA Zynq UltraScale+ Family 103320 Cells 20nm Technology 0.85V 625-Pin FCBGA Tray
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Technical Details

Supply Chain

Factory Lead Time 11 Weeks

Physical

Package / Case 625-BFBGA, FCBGA

Technical

Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq? UltraScale+? MPSoC CG
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 180
Speed 500MHz, 1.2GHz
RAM Size 256KB
Core Processor Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq?UltraScale+? FPGA, 103K+ Logic Cells

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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