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XC7Z030-1FF676I

Xilinx Inc.
RoHS
/
Package 676-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 667MHZ 676FCBGA
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Technical Details

Supply Chain

Factory Lead Time 11 Weeks

Physical

Package / Case 676-BBGA, FCBGA
Surface Mount YES

Technical

Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq?-7000
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
Additional Feature GPIO WITH FOUR 32-BIT BANKS
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
JESD-30 Code S-PBGA-B676
Number of I/O 4
Speed 667MHz
RAM Size 256KB
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA
Clock Frequency 667MHz
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex?-7 FPGA, 125K Logic Cells
Bus Compatibility CAN, ETHERNET, I2C, PCI, SPI, UART, USB

Compliance

RoHS Status Non-RoHS Compliant

Alternative Model

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