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M2S150TS-1FCVG484

Microsemi Corporation
RoHS
/
Package 484-BFBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-M3 166MHZ 484FBGA
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Technical Details

Supply Chain

Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)

Physical

Package / Case 484-BFBGA
Surface Mount YES

Technical

Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion?2
JESD-609 Code e3
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Supply Voltage-Max (Vsup) 1.26V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 273
Speed 166MHz
RAM Size 64KB
Core Processor ARM? Cortex?-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 150K Logic Modules
Flash Size 512KB

Dimensions

Height Seated (Max) 3.15mm
Length 19mm
Width 19mm

Compliance

RoHS Status Non-RoHS Compliant

Alternative Model

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