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5ASTMD5E3F31I5N

Intel
RoHS
RoHS RoHS compliant
Package 896-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 800MHZ 896FBGA
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Technical Details

Supply Chain

Factory Lead Time 8 Weeks

Physical

Package / Case 896-BBGA, FCBGA
Surface Mount YES

Technical

Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria V ST
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 896
Terminal Finish TIN SILVER COPPER
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number 5ASTMD5
JESD-30 Code S-PBGA-B896
Supply Voltage-Max (Vsup) 1.13V
Supply Voltage-Min (Vsup) 1.07V
Number of I/O MCU - 208, FPGA - 250
Speed 800MHz
RAM Size 64KB
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA, POR, WDT
Clock Frequency 622MHz
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 350K Logic Elements

Dimensions

Height Seated (Max) 2.7mm
Length 31mm
Width 31mm

Compliance

RoHS Status RoHS Compliant

Alternative Model

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