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ADUC847BCP8-3
Rochester Electronics, LLCRoHS
/
Package 56-VFQFN Exposed Pad, CSP
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description
8052 MICROCONV. 16/24-BIT ADC
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Technical Details
Physical
Mounting Type Surface Mount
Package / Case 56-VFQFN Exposed Pad, CSP
Surface Mount YES
Technical
Operating Temperature -40°C~85°C
Packaging Tray
Series MicroConverter? ADuC8xx
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 56
Terminal Finish TIN LEAD
Technology CMOS
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 240
Supply Voltage 3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 56
JESD-30 Code S-XQCC-N56
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Oscillator Type Internal
Number of I/O 34
Speed 12.58MHz
RAM Size 2.25K x 8
Voltage - Supply (Vcc/Vdd) 2.7V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor 8052
Peripherals POR, PSM, PWM, Temp Sensor, WDT
Clock Frequency 0.032768MHz
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 8KB 8K x 8
Connectivity I2C, SPI, UART/USART
Bit Size 8
Data Converter A/D 10x24b; D/A 1x12b, 2x16b
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels YES
Address Bus Width 24
EEPROM Size 4K x 8
External Data Bus Width 8
Dimensions
Height Seated (Max) 1mm
Length 8mm
Width 8mm
Compliance
RoHS Status Non-RoHS Compliant
Alternative Model
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