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Package 20-DIP (0.300, 7.62mm)
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description IC MCU 8BIT 8KB FLASH 20DIP
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Technical Details

Physical

Mount Through Hole
Mounting Type Through Hole
Package / Case 20-DIP (0.300, 7.62mm)
Number of Pins 20

Technical

Operating Temperature -40°C~85°C TA
Packaging Tube
Published 2005
Series PSOC?1 CY8C26xxx
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 20
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Other Microprocessor ICs
Technology CMOS
Terminal Position DUAL
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Frequency 24MHz
Base Part Number CY8C26233
Pin Count 20
Supply Voltage-Max (Vsup) 5.25V
Power Supplies 3.3/5V
Supply Voltage-Min (Vsup) 3V
Interface SPI, UART, USART
Memory Size 8kB
Oscillator Type Internal
Number of I/O 16
RAM Size 256 x 8
Voltage - Supply (Vcc/Vdd) 3V~5.25V
Core Processor M8C
Peripherals LVD, POR, PWM, WDT
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 8KB 8K x 8
Connectivity SPI, UART/USART
Data Converter A/D 1x8b, 1x11b, 1x12b; D/A 1x9b
Access Time 24 μs
Standby Current-Max 0.000005A
Boundary Scan NO
RAM (words) 256
UV Erasable N
ROM Size (bits) 8192Bits

Dimensions

Height Seated (Max) 4.826mm
Length 25.527mm
Width 7.62mm

Compliance

Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
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