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XE167K72F66LACFXQMA1

Infineon Technologies
RoHS
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Package 144-LQFP Exposed Pad
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description MCU 16-bit XE166 CISC/DSP/RISC 576KB Flash 3.3V 144-Pin LQFP EP
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Technical Details

Physical

Mounting Type Surface Mount
Package / Case 144-LQFP Exposed Pad
Supplier Device Package 144-LQFP (20x20)

Technical

Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2008
Series XE16x
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Base Part Number SA*XE167K
Oscillator Type Internal
Number of I/O 118
Speed 66MHz
RAM Size 50K x 8
Voltage - Supply (Vcc/Vdd) 3V~5.5V
Core Processor C166SV2
Peripherals I2S, POR, PWM, WDT
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 576KB 576K x 8
Connectivity EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Data Converter A/D 16x10b

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