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XLF208-128-FB236-C10

XMOS
RoHS
RoHS RoHS compliant
Package 236-LFBGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description IC MCU 32BIT 1MB FLASH 236FBGA
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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Physical

Mounting Type Surface Mount
Package / Case 236-LFBGA
Number of Pins 236
Supplier Device Package 236-FBGA (10x10)

Technical

Operating Temperature 0°C~70°C TA
Packaging Tray
Published 2015
Series XLF
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Memory Size 1MB
Oscillator Type External
Number of I/O 128
Speed 1000MIPS
RAM Size 128K x 8
Memory Type FLASH
Voltage - Supply (Vcc/Vdd) 0.95V~3.6V
Core Processor XCore
Program Memory Type FLASH
Core Size 32-Bit 8-Core
Program Memory Size 1MB 1M x 8
Core Architecture XCore

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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