XE164H72F66LACFXQMA1

Infineon Technologies

RoHS

RoHS compliant

Package 100-LQFP Exposed Pad

Category Integrated Circuits (ICs) / Embedded - Microcontrollers

Description MCU 16-bit XE166 CISC/DSP/RISC 576KB Flash 3.3V/5V 100-Pin LQFP EP

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Technical Details

Supply Chain

Factory Lead Time 17 Weeks

Physical

Mount Surface Mount

Mounting Type Surface Mount

Package / Case 100-LQFP Exposed Pad

Number of Pins 100

Technical

Operating Temperature -40°C~85°C TA

Packaging Tray

Published 2008

Series XE16x

Part Status Not For New Designs

Moisture Sensitivity Level (MSL) 3 (168 Hours)

Number of Terminations 100

Subcategory Microcontrollers

Max Power Dissipation 1W

Technology CMOS

Terminal Position QUAD

Terminal Form GULL WING

Frequency 16.5MHz

Qualification Status Not Qualified

Interface CAN

Memory Size 576kB

Oscillator Type Internal

Number of I/O 75

Speed 80 MHz

RAM Size 50K x 8

Voltage - Supply (Vcc/Vdd) 3V~5.5V

Core Processor C166SV2

Peripherals I2S, POR, PWM, WDT

Program Memory Type FLASH

Core Size 16-Bit

Program Memory Size 576KB 576K x 8

Connectivity CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI

Bit Size 16

Data Converter A/D 16x10b

Data Bus Width 16b

Number of Timers/Counters 5

RAM (bytes) 32768

Compliance

RoHS Status ROHS3 Compliant

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