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XC7Z045-2FF900E

Xilinx Inc.
RoHS
/
Package 900-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 800MHZ 900FCBGA
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Technical Details

Supply Chain

Factory Lead Time 10 Weeks

Physical

Package / Case 900-BBGA, FCBGA
Surface Mount YES

Technical

Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq?-7000
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
Additional Feature GPIO WITH FOUR 32-BIT BANKS
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Frequency 800MHz
JESD-30 Code S-PBGA-B900
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex?-7 FPGA, 350K Logic Cells
Bus Compatibility CAN, ETHERNET, I2C, PCI, SPI, UART, USB

Compliance

RoHS Status Non-RoHS Compliant

Alternative Model

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