Operating Temperature 0┬?C~100┬?C TJ
Packaging Tray
Published 2016
Series Zynq┬? UltraScale+ō?ó MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 464
Speed 600MHz, 667MHz, 1.5GHz
RAM Size 256KB
Core Processor Quad ARM┬? Cortex┬?-A53 MPCoreō?ó with CoreSightō?ó, Dual ARM┬?Cortexō?ó-R5 with CoreSightō?ó, ARM Maliō?ó-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq┬?UltraScale+ō?ó FPGA, 504K+ Logic Cells