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XCZU19EG-L2FFVC1760E

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 1760-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 1760FCBGA
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Technical Details

Supply Chain

Factory Lead Time 11 Weeks

Physical

Package / Case 1760-BBGA, FCBGA
Surface Mount YES

Technical

Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq? UltraScale+? MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B1760
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 512
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq?UltraScale+? FPGA, 1143K+ Logic Cells

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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