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XC7Z007S-1CLG225C

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 225-LFBGA, CSPBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 667MHZ 225BGA
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Inventory: 333
Minimum: 1
Total Price: USD $55.24
Unit Price: USD $55.23672
≥1 USD $55.23672

Technical Details

Supply Chain

Factory Lead Time 10 Weeks

Physical

Package / Case 225-LFBGA, CSPBGA
Surface Mount YES

Technical

Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2016
Series Zynq?-7000
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 225
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B225
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Number of I/O 54
Speed 667MHz
RAM Size 256KB
Core Processor Single ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA
Clock Frequency 667MHz
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Artix?-7 FPGA, 23K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; PCI; SPI; UART; USB

Dimensions

Height Seated (Max) 1.5mm
Length 13mm
Width 13mm

Compliance

RoHS Status ROHS3 Compliant
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