Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq?-7000
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 225
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B225
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Number of I/O 54
Speed 766MHz
RAM Size 256KB
Core Processor Single ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA
Clock Frequency 800MHz
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Boundary Scan YES
RAM (words) 256000
Primary Attributes Artix?-7 FPGA, 23K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB