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115-93-424-41-001000

Mill-Max Manufacturing Corp.
RoHS
/
Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description DIP SOCKET Transistor Socket
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Technical Details

Physical

Mount Through Hole
Mounting Type Through Hole
Number of Pins 24
Insulation Material Polychlorinated
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Number of Positions or Pins (Grid) 24 (2 x 12)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass Alloy

Dimensions

Length 30.48mm
Width 12.7mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 200.0μin 5.08μm

Technical

Operating Temperature -55°C~125°C
Packaging Tube
Series 115
JESD-609 Code e0
Feature Open Frame
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.4 (10.16mm) Row Spacing
Number of Rows 2
Additional Feature DIP SOCKET
HTS Code 8536.90.40.00
Voltage - Rated DC 150V
Contact Finish - Mating Gold
Orientation Straight
Depth 12.7mm
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Voltage - Rated AC 100V
Number of Contacts 24
Contact Finish - Post Tin-Lead
Contact Resistance 10mOhm
Insulation Resistance 10GOhm
Row Spacing 10.16 mm
Termination Post Length 0.108 2.74mm
Pitch - Post 0.100 2.54mm

Compliance

RoHS Status Non-RoHS Compliant

Alternative Model

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