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ICF-308-TM-O-TR

Samtec Inc.
RoHS
RoHS RoHS compliant
Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description Conn DIP Socket SKT 8 POS 2.54mm Solder ST SMD T/R
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Technical Details

Supply Chain

Factory Lead Time 3 Weeks

Physical

Contact Material Copper
Mount Surface Mount
Mounting Type Surface Mount
Insulation Material Polymer
Housing Material Liquid Crystal Polymer (LCP)
Number of Positions or Pins (Grid) 8 (2 x 4)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper

Dimensions

Length 10.16mm

Compliance

Radiation Hardening No
RoHS Status ROHS3 Compliant

Technical

Operating Temperature -55°C~125°C
Packaging Tape & Reel (TR)
Series iCF
JESD-609 Code e3
Feature Open Frame
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Rows 2
Gender Female
Contact Finish - Mating Tin
Orientation Straight
Depth 9.53mm
Current Rating 1A
Pitch - Mating 0.100 2.54mm
Number of Contacts 8
Contact Resistance 10mOhm
Row Spacing 7.62 mm
Pitch - Post 0.100 2.54mm
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