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345725-5

TE Connectivity AMP Connectors
RoHS
/
Package TSSOP
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description IC & Component Sockets 22P OPEN FRAME DIP 3456
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Inventory: 5157
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Technical Details

Supply Chain

Factory Lead Time 10 Weeks

Physical

Contact Material Copper
Contact Plating Lead, Tin
Mount Vertical
Mounting Type Through Hole
Package / Case TSSOP
Number of Positions or Pins (Grid) 22 (2 x 11)
Contact Material - Mating Beryllium Copper

Technical

Packaging Tube
Published 2007
JESD-609 Code e0
Feature Open Frame
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.4 (10.16mm) Row Spacing
Max Operating Temperature 125°C
Min Operating Temperature 0°C
Number of Rows 2
Gender Female
HTS Code 8536.69.40.40
Contact Finish - Mating Tin-Lead
Max Power Dissipation 13W
Orientation Straight
Pitch - Mating 0.100 2.54mm
Lead Pitch 2.54mm
Number of Contacts 22
Lead Length 2.84mm
Contact Style Screw
Contact Resistance 30mOhm
Insulation Resistance 10GOhm
Row Spacing 10.16 mm
Number of Channels 1
ELV Non-Compliant
Operating Supply Current 580μA
Termination Post Length 0.112 2.84mm
Pitch - Post 0.100 2.54mm

Compliance

Radiation Hardening No
RoHS Status Non-RoHS Compliant

Alternative Model

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