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Category Connectors, Interconnects / Sockets for ICs, Transistors
Description CONN IC DIP SOCKET 8POS GOLD
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Technical Details

Physical

Contact Material Bronze
Mount Vertical
Mounting Type Through Hole
Insulation Material Thermoplastic
Housing Material Thermoplastic, Glass Filled
Number of Positions or Pins (Grid) 8 (2 x 4)
Contact Material - Mating Phosphor Bronze
Contact Material - Post Phosphor Bronze

Dimensions

Length 10.03mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 15.0μin 0.38μm

Compliance

Material Flammability Rating UL94 V-0
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Contains Lead

Technical

Operating Temperature -55°C~125°C
Packaging Tube
Published 2005
Series Diplomate DL
JESD-609 Code e0
Feature Closed Frame
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Positions 8
Color Black
Number of Rows 2
Gender Female
Additional Feature UL 94V-0, DIPLOMATE
Contact Finish - Mating Gold
Orientation Straight
Depth 10.01mm
Pitch - Mating 0.100 2.54mm
Number of Contacts 8
PCB Contact Pattern RECTANGULAR
Body Breadth 0.394 inch
Lead Length 3.05mm
Contact Style DUAL PRONG
Contact Resistance 30mOhm
Insulation Resistance 10GOhm
Row Spacing 7.87 mm
Mating Contact Pitch 0.1 inch
ELV Non-Compliant
Dielectric Withstanding Voltage 1000VAC V
Termination Post Length 0.120 3.05mm
Pitch - Post 0.100 2.54mm
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