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Category Connectors, Interconnects / Sockets for ICs, Transistors
Description IC & Component Sockets OBSOLETE
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Technical Details

Physical

Contact Material Copper
Mount Through Hole
Mounting Type Through Hole
Housing Material Aluminum Alloy
Number of Positions or Pins (Grid) 20 (2 x 10)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper

Dimensions

Height 4.2mm
Length 25.4mm
Width 7.62mm
Contact Finish Thickness - Mating 20.0μin 0.51μm
Contact Finish Thickness - Post 20.0μin 0.51μm

Compliance

Material Flammability Rating UL94 V-0
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

Technical

Operating Temperature -55°C~125°C
Published 2005
Series 700
JESD-609 Code e0
Feature Carrier, Closed Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Rows 2
Gender Female
Additional Feature DIP SOCKET
HTS Code 8536.69.40.40
Contact Finish - Mating Gold
Orientation Straight
Reach Compliance Code unknown
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Voltage - Rated AC 300V
Number of Contacts 20
Contact Resistance 10mOhm
Insulation Resistance 5GOhm
Row Spacing 7.62 mm
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
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