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Category Connectors, Interconnects / Sockets for ICs, Transistors
Description CONN SOCKET SIP 8POS TIN
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Technical Details

Physical

Mount Through Hole
Mounting Type Through Hole
Housing Material Thermoplastic, Glass Filled
Number of Positions or Pins (Grid) 8 (1 x 8)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper

Technical

Operating Temperature -55°C~105°C
Packaging Tube
Published 2008
Series Diplomate DL
JESD-609 Code e3
Feature Closed Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type SIP
Color Black
Number of Rows 1
Additional Feature DIPLOMATE, UL 94V-0
Contact Finish - Mating Tin
Orientation Straight
Reach Compliance Code unknown
Pitch - Mating 0.100 2.54mm
Number of Contacts 8
Termination Post Length 0.130 3.30mm
Pitch - Post 0.100 2.54mm

Compliance

Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Lead Free Lead Free
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