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SIP1X09-001BLF

Amphenol ICC (FCI)
RoHS
/
Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description Transistor Socket
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Technical Details

Physical

Contact Material Copper
Mount Through Hole
Mounting Type Through Hole
Insulation Material Polyphenylene
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Number of Positions or Pins (Grid) 9 (1 x 9)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass

Technical

Packaging Bulk
Published 2006
Series SIP1x
JESD-609 Code e4
Feature Closed Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type SIP
Number of Rows 1
Contact Finish - Mating Gold
Orientation Straight
Depth 2.54mm
Current Rating 2A
Pitch - Mating 0.100 2.54mm
Voltage - Rated AC 100V
Number of Contacts 9
Contact Finish - Post Tin
Lead Length 3.175mm
Contact Resistance 10mOhm
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm

Dimensions

Height 4.19mm
Length 22.86mm
Width 2.54mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 200.0μin 5.08μm

Compliance

Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
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