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DIP632-001BLF

Amphenol ICC (FCI)
RoHS
/
Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description ICs Socket
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Technical Details

Physical

Contact Material Copper
Mount Through Hole
Mounting Type Through Hole
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Number of Positions or Pins (Grid) 32 (2 x 16)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass

Technical

Packaging Tube
Published 2007
JESD-609 Code e3
Feature Open Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.6 (15.24mm) Row Spacing
HTS Code 8536.69.40.40
Contact Finish - Mating Gold
Terminal Pitch 2.54mm
Pitch - Mating 0.100 2.54mm
Number of Contacts 32
Contact Finish - Post Tin
PCB Contact Pattern RECTANGULAR
Body Breadth 0.7 inch
Lead Length 3.175mm
Body Depth 0.165 inch
Contact Style RND PIN-SKT
Mating Contact Pitch 0.1 inch
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm

Dimensions

Height 4.19mm
Length 40.6mm
Width 17.8mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 200.0μin 5.08μm

Compliance

Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0

Alternative Model

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