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DIP640-001BLF

Amphenol ICC (FCI)
RoHS
/
Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description ICs Socket
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Technical Details

Physical

Contact Material Copper
Mount Through Hole
Mounting Type Through Hole
Insulation Material Polychlorinated
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Number of Positions or Pins (Grid) 40 (2 x 20)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass

Technical

Packaging Tube
Published 2007
JESD-609 Code e3
Feature Open Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.6 (15.24mm) Row Spacing
Number of Rows 2
Contact Finish - Mating Gold
Orientation Straight
Depth 17.78mm
Pitch - Mating 0.100 2.54mm
Number of Contacts 40
Contact Finish - Post Tin
PCB Contact Pattern RECTANGULAR
Body Breadth 0.7 inch
Lead Length 3.175mm
Contact Style RND PIN-SKT
Row Spacing 15.24 mm
Mating Contact Pitch 0.1 inch
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm

Dimensions

Length 50.8mm
Width 17.8mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 200.0μin 5.08μm

Compliance

Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0

Alternative Model

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