Contact Material Copper
Contact Plating Gold
Mount Through Hole
Mounting Type Through Hole
Package / Case SOIC
Number of Pins 28
Housing Material Polyethersulfone (PES), Glass Filled
Weight 453.59237g
Number of Positions or Pins (Grid) 28 (2 x 14)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper