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28-516-10

Aries Electronics
RoHS
/
Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description CONN IC DIP SOCKET ZIF 28POS TIN
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Technical Details

Physical

Contact Material Copper
Mount Through Hole
Mounting Type Through Hole
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Number of Positions or Pins (Grid) 28 (2 x 14)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper

Dimensions

Height 11.1mm
Length 41.1mm
Width 19.8mm
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 10.0μin 0.25μm

Technical

Packaging Bulk
Published 2007
Series 516
JESD-609 Code e3
Feature Closed Frame
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
ECCN Code EAR99
Type DIP, ZIF (ZIP)
Number of Positions 28
Number of Rows 2
Additional Feature UL STANDARD: 94V-0
Contact Finish - Mating Tin
Current Rating (Amps) 1A
Pitch - Mating 0.100 2.54mm
Lead Pitch 2.54mm
Number of Contacts 28
Termination Post Length 0.150 3.81mm
Pitch - Post 0.100 2.54mm

Compliance

Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Lead Free Lead Free

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