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SIP1X30-041BLF

Amphenol ICC (FCI)
RoHS
/
Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description STANDARD: UL 94V-0 ICs Socket
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Technical Details

Physical

Contact Material Copper
Mount Through Hole
Mounting Type Through Hole
Number of Pins 30
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Number of Positions or Pins (Grid) 30 (1 x 30)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass

Technical

Packaging Bulk
Published 2006
Series SIP1x
JESD-609 Code e4
Feature Closed Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type SIP
Number of Rows 1
Additional Feature STANDARD: UL 94V-0
HTS Code 8536.69.40.40
Contact Finish - Mating Gold
Pitch - Mating 0.100 2.54mm
Lead Pitch 2.54mm
Number of Contacts 30
Contact Finish - Post Tin
Lead Length 3.175mm
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm

Dimensions

Height 4.19mm
Length 78.7mm
Width 2.54mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 200.0μin 5.08μm

Compliance

Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0

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