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SIP050-1X30-160BLF

Amphenol ICC (FCI)
RoHS
/
Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description Transistor Socket
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Technical Details

Physical

Contact Material Copper
Mount Through Hole
Mounting Type Through Hole
Number of Pins 30
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Number of Positions or Pins (Grid) 30 (1 x 30)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass

Technical

Packaging Bulk
Published 2007
Series SIP050-1x
JESD-609 Code e4
Feature Closed Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type SIP
HTS Code 8536.69.40.40
Contact Finish - Mating Gold
Pitch - Mating 0.100 2.54mm
Number of Contacts 30
Contact Finish - Post Tin
PCB Contact Pattern RECTANGULAR
Body Breadth 0.1 inch
Lead Length 2.413mm
Body Depth 0.095 inch
Contact Style RND PIN-SKT
Mating Contact Pitch 0.1 inch
Termination Post Length 0.095 2.41mm
Pitch - Post 0.100 2.54mm

Dimensions

Height 2.41mm
Length 78.7mm
Width 2.54mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 200.0μin 5.08μm

Compliance

Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0

Alternative Model

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