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Category Connectors, Interconnects / Sockets for ICs, Transistors
Description CONN IC DIP SOCKET 28POS TIN
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Technical Details

Physical

Mount Through Hole
Mounting Type Through Hole
Housing Material Polybutylene Terephthalate (PBT)
Number of Positions or Pins (Grid) 28 (2 x 14)
Contact Material - Mating Phosphor Bronze
Contact Material - Post Phosphor Bronze

Technical

Operating Temperature -55°C~85°C
Packaging Tube
Published 2009
JESD-609 Code e3
Feature Open Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.3 (7.62mm) Row Spacing
Gender Female
HTS Code 8536.69.40.40
Contact Finish - Mating Tin
Orientation Straight
Reach Compliance Code unknown
Pitch - Mating 0.100 2.54mm
Number of Contacts 28
Contact Resistance 30mOhm
Max Current Rating 1A
Termination Post Length 0.124 3.15mm
Pitch - Post 0.100 2.54mm

Dimensions

Contact Finish Thickness - Mating 60.0μin 1.52μm
Contact Finish Thickness - Post 60.0μin 1.52μm

Compliance

Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Lead Free Lead Free
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