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2-5916783-7

TE Connectivity AMP Connectors
RoHS
/
Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description LOW PROFILE Transistor Socket
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Technical Details

Physical

Mount Through Hole
Mounting Type Through Hole
Housing Material Liquid Crystal Polymer (LCP)
Number of Positions or Pins (Grid) 370 (19 x 19)
Contact Material - Mating Copper Alloy
Contact Material - Post Copper Alloy

Technical

Packaging Tray
JESD-609 Code e3
Feature Open Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type PGA, ZIF (ZIP)
Additional Feature LOW PROFILE
HTS Code 8536.69.40.40
Contact Finish - Mating Gold
Orientation Straight
Reach Compliance Code unknown
Pitch - Mating 0.100 2.54mm
Number of Contacts 370
Housing Color Natural
Insulation Resistance 5GOhm
ELV Compliant
Termination Post Length 0.093 2.36mm
Pitch - Post 0.100 2.54mm

Dimensions

Contact Finish Thickness - Mating Flash

Compliance

Material Flammability Rating UL94 V-0
Flammability Rating UL94 V-0

Alternative Model

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