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Category Connectors, Interconnects / Sockets for ICs, Transistors
Description IC & Component Sockets 820-AG12D-LF 800 DIP PCB SN/SN
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Technical Details

Physical

Mount Vertical
Mounting Type Through Hole
Insulation Material Polyester
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Number of Positions or Pins (Grid) 20 (2 x 10)
Contact Material - Mating Beryllium Copper
Contact Material - Post Copper

Technical

Operating Temperature -55°C~105°C
Packaging Tube
Published 2008
Series 800
JESD-609 Code e3
Feature Open Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Rows 2
Additional Feature STANDARD: UL 94V-0
HTS Code 8536.69.40.40
Contact Finish - Mating Tin
Orientation Straight
Depth 10.16mm
Pitch - Mating 0.100 2.54mm
Number of Contacts 20
Lead Length 3.18mm
Contact Style Screw
Contact Resistance 10mOhm
Insulation Resistance 5GOhm
Row Spacing 7.62 mm
ELV Compliant
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm

Dimensions

Length 25.4mm

Compliance

Material Flammability Rating UL94 V-0
Radiation Hardening No
RoHS Status RoHS Compliant
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