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1-1814642-3

TE Connectivity AMP Connectors
RoHS
/
Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description CONN IC DIP SOCKET 18POS GOLD
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Technical Details

Physical

Contact Material Copper
Contact Plating Gold
Mount Through Hole
Mounting Type Through Hole
Housing Material Thermoplastic, Polyester
Number of Positions or Pins (Grid) 18 (2 x 9)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass

Technical

Operating Temperature -55°C~125°C
Packaging Tube
Published 2006
Feature Open Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Positions 18
Color Black
Number of Rows 2
Contact Finish - Mating Gold
Current Rating (Amps) 1A
Pitch 2.54mm
Orientation Straight
Pitch - Mating 0.100 2.54mm
Number of Contacts 18
Contact Finish - Post Gold
Contact Resistance 10mOhm
Insulation Resistance 10GOhm
ELV Compliant
Termination Post Length 0.112 2.84mm
Pitch - Post 0.100 2.54mm

Dimensions

Contact Finish Thickness - Mating 29.5μin 0.75μm
Contact Finish Thickness - Post 29.5μin 0.75μm

Compliance

Material Flammability Rating UL94 V-0
Radiation Hardening No
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0

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