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RoHS
RoHS RoHS compliant
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Category Connectors, Interconnects / Sockets for ICs, Transistors
Description IC & Component Sockets 24P DIP SOK CB .600 CL 30AU/SN
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Technical Details

Physical

Contact Material Copper
Mount Vertical
Mounting Type Through Hole
Housing Material Thermoplastic, Glass Filled
Body Material Thermoplastic
Number of Positions or Pins (Grid) 24 (2 x 12)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper

Technical

Operating Temperature -55°C~125°C
Packaging Tube
Published 2010
Series Diplomate DL
JESD-609 Code e3
Feature Closed Frame
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type DIP, Socket
Type DIP, 0.6 (15.24mm) Row Spacing
Number of Positions 24
Color Black
Number of Rows 2
Gender Female
HTS Code 8536.69.40.40
Contact Finish - Mating Gold
Orientation Straight
Terminal Pitch 2.54mm
Depth 17.63mm
Pitch - Mating 0.100 2.54mm
Approval Agency CSA, UL
Number of Contacts 24
Lead Length 3.25mm
Contact Resistance 30mOhm
Insulation Resistance 10GOhm
Row Spacing 15.49 mm
ELV Compliant
Termination Post Length 0.128 3.24mm
Pitch - Post 0.100 2.54mm

Dimensions

Length 30.35mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 30.0μin 0.76μm

Compliance

Material Flammability Rating UL94 V-0
Radiation Hardening No
REACH SVHC Unknown
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Lead Free
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