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3-1825046-0

TE Connectivity AMP Connectors
RoHS
/
Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description CONN IC DIP SOCKET 32POS GOLD
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Technical Details

Supply Chain

Factory Lead Time 17 Weeks

Physical

Contact Material Copper
Contact Plating Gold, Tin
Mount Vertical
Mounting Type Surface Mount
Housing Material Thermoplastic
Number of Positions or Pins (Grid) 32 (2 x 16)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass

Technical

Packaging Tube
Published 2006
Series 800
Feature Open Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type DIP, 0.6 (15.24mm) Row Spacing
Number of Positions 32
Max Operating Temperature -125°C
Min Operating Temperature -55°C
Number of Rows 2
Contact Finish - Mating Gold
Pitch 2.54mm
Orientation Straight
Pitch - Mating 0.100 2.54mm
Number of Contacts 32
Contact Style Screw
Contact Resistance 10mOhm
Insulation Resistance 5GOhm
Row Spacing 15.24 mm
ELV Compliant
Pitch - Post 0.100 2.54mm

Compliance

RoHS Status RoHS Compliant

Alternative Model

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