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RoHS
RoHS RoHS compliant
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Category Connectors, Interconnects / Sockets for ICs, Transistors
Description IC & Component Sockets 524-AG11D-ESL-LF=500 DIP,GF/SN
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Technical Details

Physical

Contact Material Copper
Contact Plating Tin
Mount Vertical
Mounting Type Through Hole
Insulation Material Polyester
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Number of Positions or Pins (Grid) 24 (2 x 12)
Contact Material - Mating Beryllium Copper
Contact Material - Post Nickel

Technical

Operating Temperature -55°C~125°C
Packaging Tube
Published 2005
Series 500
JESD-609 Code e3
Feature Closed Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.6 (15.24mm) Row Spacing
Number of Rows 2
Additional Feature STANDARD: UL 94V-0
HTS Code 8536.69.40.40
Contact Finish - Mating Gold
Orientation Straight
Depth 17.78mm
Pitch - Mating 0.100 2.54mm
Number of Contacts 24
Lead Length 3.18mm
Contact Resistance 10mOhm
Insulation Resistance 5GOhm
Row Spacing 15.24 mm
ELV Compliant
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm

Compliance

Material Flammability Rating UL94 V-0
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

Dimensions

Length 30.48mm
Contact Finish Thickness - Mating Flash
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