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Category Connectors, Interconnects / Sockets for ICs, Transistors
Description IC & Component Sockets 814-AG12SM-LF
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Technical Details

Physical

Contact Material Copper
Contact Plating Tin
Mount Vertical
Mounting Type Surface Mount
Number of Positions or Pins (Grid) 14 (2 x 7)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass

Technical

Packaging Tube
Published 2013
Series 800
Feature Open Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Positions 14
Contact Finish - Mating Tin
Pitch 2.54mm
Pitch - Mating 0.100 2.54mm
Contact Style Screw
Contact Resistance 10mOhm
Insulation Resistance 5GOhm
Row Spacing 7.62 mm
ELV Compliant
Pitch - Post 0.100 2.54mm

Compliance

RoHS Status RoHS Compliant
Lead Free Lead Free
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