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RoHS
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Package LGA
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description IC & Component Sockets LGA 1366 Socket
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Technical Details

Supply Chain

Factory Lead Time 14 Weeks

Physical

Contact Material Copper
Contact Plating Gold
Mount Solder, Surface Mount
Mounting Type Surface Mount
Package / Case LGA
Number of Pins 1366
Insulation Material Thermoplastic
Housing Material Thermoplastic
Number of Positions or Pins (Grid) 1366 (32 x 41)
Contact Material - Mating Copper Alloy
Contact Material - Post Copper Alloy

Technical

Packaging Tray
Published 2011
Feature Open Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Socket
Type LGA
Number of Positions 1366
Gender Female
Contact Finish - Mating Gold
Pitch 1.016mm
Orientation Straight
Depth 47.5mm
Pitch - Mating 0.040 1.02mm
Number of Contacts 1366
Housing Color Black
Contact Resistance 15mOhm
Insulation Resistance 800MOhm
Row Spacing 1.016 mm
ELV Compliant
Plating Gold
Pitch - Post 0.040 1.01mm

Compliance

Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Lead Free
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