LPC1813JET100E

NXP USA Inc.

RoHS

RoHS compliant

Package 100-TFBGA

Category Integrated Circuits (ICs) / Embedded - Microcontrollers

Description MCU 32-bit LPC1800 ARM Cortex M3 RISC 512KB Flash 3.3V 100-Pin TFBGA Tray

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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Dimensions

Length 9mm

Width 9mm

Technical

Operating Temperature -40°C~105°C TA

Packaging Tray

Published 2011

Series LPC18xx

Part Status Active

Moisture Sensitivity Level (MSL) 3 (168 Hours)

Number of Terminations 100

Subcategory Microcontrollers

Technology CMOS

Terminal Position BOTTOM

Terminal Form BALL

Supply Voltage 3.3V

Terminal Pitch 0.8mm

Base Part Number LPC1813

Pin Count 100

JESD-30 Code S-PBGA-B100

Qualification Status Not Qualified

Supply Voltage-Max (Vsup) 3.6V

Power Supplies 2.5/3.3V

Supply Voltage-Min (Vsup) 2.2V

Oscillator Type Internal

Number of I/O 49

Speed 180MHz

RAM Size 104K x 8

Voltage - Supply (Vcc/Vdd) 2.2V~3.6V

uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

Core Processor ARM? Cortex?-M3

Peripherals Brown-out Detect/Reset, DMA, I2S, POR, WDT

Clock Frequency 25MHz

Program Memory Type FLASH

Core Size 32-Bit

Program Memory Size 512KB 512K x 8

Connectivity CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART

Bit Size 32

Data Converter A/D 4x10b; D/A 1x10b

Has ADC YES

DMA Channels YES

PWM Channels YES

ROM (words) 524288

EEPROM Size 16K x 8

CPU Family CORTEX-M3

Compliance

RoHS Status ROHS3 Compliant

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