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MBRF20035

GeneSiC Semiconductor
RoHS
/
Package TO-244AB
Category Discrete Semiconductor Products / Diodes - Rectifiers - Arrays
Description Conn Wire to Board HDR 8 POS 3.96mm Solder RA Thru-Hole Bag
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Technical Details

Supply Chain

Factory Lead Time 7 Weeks

Physical

Mount Chassis Mount, Through Hole
Mounting Type Chassis Mount
Package / Case TO-244AB
Diode Element Material SILICON

Technical

Packaging Bulk
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination Solder
ECCN Code EAR99
Max Operating Temperature 75°C
Min Operating Temperature 0°C
Gender Male
Pitch 3.96mm
Terminal Position UPPER
Orientation Right Angle
Terminal Form UNSPECIFIED
JESD-30 Code R-PUFM-X2
Number of Contacts 8
Number of Elements 2
Contact Resistance 10mOhm
Element Configuration Common Cathode
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Schottky
Current - Reverse Leakage @ Vr 1mA @ 35V
Voltage - Forward (Vf) (Max) @ If 700mV @ 100A
Forward Current 200A
Operating Temperature - Junction -55°C~150°C
Application POWER
Max Reverse Voltage (DC) 35V
Average Rectified Current 100A
Number of Phases 1
Peak Reverse Current 1A
Max Repetitive Reverse Voltage (Vrrm) 35V
Diode Configuration 1 Pair Common Cathode

Compliance

RoHS Status RoHS Compliant

Alternative Model

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