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FST8360SM

GeneSiC Semiconductor
RoHS
/
Package D61-3SM
Category Discrete Semiconductor Products / Diodes - Rectifiers - Arrays
Description Conn Socket Strip RCP 10 POS 2.54mm Solder ST Thru-Hole Tray
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Technical Details

Supply Chain

Factory Lead Time 7 Weeks

Compliance

RoHS Status RoHS Compliant

Technical

Packaging Bulk
Published 2012
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Max Operating Temperature 175°C
Min Operating Temperature -40°C
Pitch 2.54mm
Orientation Straight
Number of Contacts 10
Contact Resistance 20mOhm
Element Configuration Common Cathode
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Schottky
Current - Reverse Leakage @ Vr 1.5mA @ 20V
Voltage - Forward (Vf) (Max) @ If 750mV @ 80A
Forward Current 80A
Max Reverse Leakage Current 1μA
Operating Temperature - Junction -55°C~150°C
Max Surge Current 800A
Current - Average Rectified (Io) 80A DC
Max Reverse Voltage (DC) 60V
Average Rectified Current 80A
Peak Reverse Current 1A
Max Repetitive Reverse Voltage (Vrrm) 60V
Diode Configuration 1 Pair Common Cathode

Physical

Mount Chassis Mount, Through Hole
Mounting Type Chassis Mount
Package / Case D61-3SM

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