XC1701LPDG8I | Integrated Circuits (ICs)/Memory - Configuration Proms for FPGAs

Physical

Mounting Type Through Hole

Package / Case 8-DIP (0.300, 7.62mm)

Surface Mount NO

Number of Pins 8

Dimensions

Height Seated (Max) 4.5974mm

Length 9.3599mm

Width 7.62mm

Compliance

RoHS Status RoHS Compliant

Technical

Operating Temperature -40°C~85°C

Packaging Tube

Published 2004

JESD-609 Code e3

Pbfree Code yes

Part Status Obsolete

Moisture Sensitivity Level (MSL) 1 (Unlimited)

Number of Terminations 8

ECCN Code EAR99

Terminal Finish Matte Tin (Sn)

Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

Technology CMOS

Voltage - Supply 3V~3.6V

Terminal Position DUAL

Peak Reflow Temperature (Cel) 250

Number of Functions 1

Supply Voltage 3.3V

Terminal Pitch 2.54mm

Reach Compliance Code unknown

Time@Peak Reflow Temperature-Max (s) 30

Base Part Number XC1701L

Pin Count 8

Qualification Status Not Qualified

Supply Voltage-Max (Vsup) 3.6V

Power Supplies 3.3V

Supply Voltage-Min (Vsup) 3V

Programmable Type OTP

Memory Size 1Mb

Operating Mode SYNCHRONOUS

Clock Frequency 15MHz

Supply Current-Max 0.01mA

Organization 1MX1

Output Characteristics 3-STATE

Memory Width 1

Standby Current-Max 0.00005A

Parallel/Serial SERIAL

I/O Type COMMON

Memory IC Type CONFIGURATION MEMORY