XC17S50APDG8C

Xilinx Inc.

RoHS

Package 8-DIP (0.300, 7.62mm)

Category Integrated Circuits (ICs) / Memory - Configuration Proms for FPGAs

Description XC17S50A Matte Tin (Sn) EAR99 Tube ics fpga configuration 7.62mm 0.001A 500kb 3.3V

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Inventory: 624

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Total Price: USD $178.18

Unit Price: USD $178.17744

≥1 USD $178.17744

≥10 USD $159.744638

Technical Details

Physical

Mounting Type Through Hole

Package / Case 8-DIP (0.300, 7.62mm)

Surface Mount NO

Number of Pins 8

Dimensions

Height Seated (Max) 4.5974mm

Length 9.3599mm

Width 7.62mm

Compliance

Radiation Hardening No

RoHS Status RoHS Compliant

Technical

Operating Temperature 0°C~70°C

Packaging Tube

Published 1999

JESD-609 Code e3

Pbfree Code yes

Part Status Obsolete

Moisture Sensitivity Level (MSL) 1 (Unlimited)

Number of Terminations 8

ECCN Code EAR99

Terminal Finish Matte Tin (Sn)

Technology CMOS

Voltage - Supply 3V~3.6V

Terminal Position DUAL

Peak Reflow Temperature (Cel) 250

Number of Functions 1

Supply Voltage 3.3V

Terminal Pitch 2.54mm

Time@Peak Reflow Temperature-Max (s) 30

Base Part Number XC17S50A

Pin Count 8

Operating Supply Voltage 3.3V

Supply Voltage-Max (Vsup) 3.6V

Supply Voltage-Min (Vsup) 3V

Programmable Type OTP

Memory Size 500kb

Supply Current-Max 0.015mA

Organization 559200X1

Output Characteristics 3-STATE

Memory Width 1

Density 1 Mb

Standby Current-Max 0.001A

Parallel/Serial SERIAL

I/O Type COMMON

Memory IC Type CONFIGURATION MEMORY

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