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XC17S30APD8C

Xilinx Inc.
RoHS
/
Package 8-DIP (0.300, 7.62mm)
Category Integrated Circuits (ICs) / Memory - Configuration Proms for FPGAs
Description XC17S30 EAR99 Tube 1999 ics fpga configuration 7.62mm 0.00005A 300kb 3.3V
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Inventory: 1701
Minimum: 1
Total Price: USD $42.52
Unit Price: USD $42.523425
≥1 USD $42.523425
≥10 USD $34.890555
≥100 USD $33.800288
≥500 USD $32.71002
≥1000 USD $31.619753

Technical Details

Physical

Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8

Technical

Operating Temperature 0°C~70°C
Packaging Tube
Published 1999
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S30
Pin Count 8
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 300kb
Supply Current-Max 0.005mA
Output Characteristics 3-STATE
Memory Width 1
Density 512 kb
Standby Current-Max 0.00005A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY

Dimensions

Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm

Compliance

Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

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