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SPAKXC309VF100A

NXP USA Inc.
RoHS
/
Package 196-LBGA
Category Integrated Circuits (ICs) / Embedded - DSP (Digital Signal Processors)
Description Host Interface SSI SCI 196-LBGA 2005 SPAKXC309 digital signal processor 3.3V 15mm 100MHz ROM (576B)
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Technical Details

Physical

Mounting Type Surface Mount
Package / Case 196-LBGA
Surface Mount YES

Dimensions

Height Seated (Max) 1.6mm
Length 15mm
Width 15mm

Compliance

RoHS Status Non-RoHS Compliant

Technical

Operating Temperature -40°C~105°C TJ
Packaging Tray
Published 2005
Series DSP563xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 196
ECCN Code 3A001.A.3
Type Fixed Point
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 3.3V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number SPAKXC309
JESD-30 Code S-PBGA-B196
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Interface Host Interface, SSI, SCI
Clock Frequency 100MHz
Address Bus Width 18
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 24
Voltage - I/O 3.30V
Barrel Shifter YES
Internal Bus Architecture MULTIPLE
Non-Volatile Memory ROM (576B)
On Chip Data RAM 24kB
Clock Rate 100MHz

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