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Category Connectors, Interconnects / Sockets for ICs, Transistors - Adapters
Description IC & Component Sockets 10P MMSOP/DIP ADAPT
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Technical Details

Supply Chain

Factory Lead Time 6 Weeks

Physical

Contact Plating Tin
Mounting Type Through Hole
Number of Pins 10
Contact Material - Post Brass
Board Material FR4 Epoxy Glass

Technical

Operating Temperature 105°C
Published 2009
Series Correct-A-Chip? 1111841
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Number of Rows 2
Additional Feature UL 94V-0
Pitch - Mating 0.020 0.50mm
Number of Contacts 10
Contact Finish - Post Tin-Lead
Device Socket Type IC SOCKET
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Convert From (Adapter End) MSOP
Convert To (Adapter End) DIP, 0.3 (7.62mm) Row Spacing

Dimensions

Contact Finish Thickness - Post 200.0μin 5.08μm

Compliance

RoHS Status Non-RoHS Compliant
Lead Free Lead Free
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