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20-350000-10-HT

Aries Electronics
RoHS
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Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors - Adapters
Description IC & Component Sockets HITEMP SOIC DIP ADAP 20 PINS
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Technical Details

Supply Chain

Factory Lead Time 6 Weeks

Physical

Mount Through Hole
Mounting Type Through Hole
Number of Pins 20
Housing Material POLYAMIDE
Contact Material - Post Brass
Board Material Polyimide (PI)

Technical

Published 2005
Series Correct-A-Chip? 350000
Feature High Temperature
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Additional Feature SOCKET ADAPTER
Contact Finish - Mating Tin
Pitch - Mating 0.050 1.27mm
Number of Contacts 20
Contact Finish - Post Tin-Lead
Lead Length 3.175mm
Device Socket Type IC SOCKET
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Convert From (Adapter End) SOIC
Convert To (Adapter End) DIP, 0.3 (7.62mm) Row Spacing

Dimensions

Contact Finish Thickness - Post 200.0μin 5.08μm

Compliance

RoHS Status Non-RoHS Compliant
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